Firmware Engineer
LEAP@HK,Hong Kong Science & Technology Parks Corporation
- Company Industries:Others
Job Information
- Post Date:2017-10-24
- Career Level:Entry Level
- Location:Not Specified
- Salary:Salary negotiable
- Employment Type:Full Time, Permanent
- Job Function:Electrical / Electronics Telecommunication / Wireless / Radio Software Development
Job Description
Responsibilities:
- Develop firmware for consumer electronics products that may include LoRa system, IoT products, wireless chargers, and wireless peripherals.
- Utilize testing and troubleshooting skills to deliver high quality firmware.
- Be a member of a team that includes designers, engineers, and coordinators to design, develop, and deliver final products targeting global customers.
Requirements:
- Degree holder in Electronic Engineering / Software Engineering / Computer Engineering or related disciplines.
- Familiar with C and C++.
- Self-motivated and willing to learn.
- Good command of English and Mandarin.
- 1 year or above relevant work experience.
- Fresh graduates who are enthusiastic about the electronic industry are welcome to apply.
Additional info:
- To apply, please email us with a resume that includes your expected salary and availability.
- All personal data collected will be used solely for recruitment purpose.
Company Info
The Leading Enterprises Acceleration Programme ([email protected]) is a new initiative to further support the development of companies in Hong Kong Science& Technology Parks Corporation. LEAP is an ultra-tailored programme with one goal in mind -to turn elite startups into regional or global tech giants. LEAP nurtures select members of our Incubation Programmes and companies at Science Park and prepares them for eventual IPO or M&A. Through a combination of business and corporate development, offered by HKSTP and industry experts in various fields, LEAP gives these exceptional individuals and businesses a chance to truly shine.
One of our member companies, which is a fast-growing smart wearable startup company in Hong Kong Science Park and Shenzhen Software Park, currently has the following opening:
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