Key Responsibilities

l   Responsible for ECLC (Electronics, Connector, Lead Frame, LED and Passive Components) plating product lines Management and assist Departmental Director to coordinate Technical Team activities in Hong Kong & China

• Streamline product portfolio to meet market and customer needs
• Assist to build up and coordinate effective Technical Team to enable total product solution to the customers
• Technical documentation system
• Assist product and technical training - internally and externally

l   Responsible for regional business growth (chemicals and equipment) through

• Work closely with global product managers, R&D and APAC technology team to provide guidance to local sales and technical service engineers
• Understand market ultimate requirements, and
• Identify the opportunities for new product development.
• Formulate marketing strategies for mature and new products.
• Provide support and assistance in global OEM marketing program.
• Promote company product, technology and image through customer visits and marketing campaign. 

Job Requirements

l   University degree in Chemistry / Chemical Engineering / Material Science or other related disciplines. (Electronic, Electrical, etc. non-Chemistry related disciplines are not considered)

l   Min 5 years sales and/or plating products experience in electronic components plating, with at least 2 years in Management role 

l   Requires people management, leadership skills and customer management experience.

l   Able to plan, organize, multitask, prioritize, and troubleshoot

l   Good command of spoken and written in English, Mandarin and Cantonese

l   Hong Kong or China based position with frequent travel to China

 We offer competitive remuneration package including discretionary bonus, annual leaves, medical benefit and good opportunity for career development to successful candidate(s). Interested parties please forward full resume stating your availability, present & expected salary and contact information to: hra@technic-chk.com.

 Personal data collected will be treated in the strictest confidence and only be used for recruitment related purpose. Information of unsuccessful applicants will be destroyed within six months.