Firmware Engineer
LEAP@HK,Hong Kong Science & Technology Parks Corporation
- Company Industries:Others
Job Information
- Post Date:2018-04-13
- Career Level:Entry Level
- Location:Not Specified
- Salary:Salary negotiable
- Employment Type:Full Time, Permanent
- Job Function:Electrical / Electronics Telecommunication / Wireless / Radio Software Development
Job Description
Responsibilities:
- Embedded software development for Bluetooth, BLE, IOT etc.
- Firmware development for system verification and test automation.
- Work with hardware team to design and develop prototype board for product testing.
- Assist in writing documentation like product user guide and product specifications.
- Design and develop MCU based product applications.
- Design and develop application software for early stages of product development.
- Product development from concept to mass production.
Requirements:
- Degree holder in Electronic Engineering, Computer Engineering or similar discipline.
- Proficient in C programming and debugging.
- Strong background in embedded wireless systems (C and C++ languages, MIPS and ARM CPU architecture).
- Experience with wireless induction charging is a plus (Proprietary methods, Qi, A4WP).
- Excellent troubleshooting and problem solving skills with smart common sense.
- Experience with industry standards for wireless communications (such as Bluetooth, WLAN, or Zigbee, is also desirable).
- Self-motivated, well-organized, independent and excellent interpersonal and communication skills.
- Minimum 2 years of embedded Software development.
- Less experienced or fresh graduates may be considered as "Assistant Firmware Engineer".
Additional info:
To apply, please email us with a resume that includes your expected salary and availability.
All personal data collected will be used solely for recruitment purpose.
Company Info
The Leading Enterprises Acceleration Programme ([email protected]) is a new initiative to further support the development of companies in Hong Kong Science& Technology Parks Corporation. LEAP is an ultra-tailored programme with one goal in mind -to turn elite startups into regional or global tech giants. LEAP nurtures select members of our Incubation Programmes and companies at Science Park and prepares them for eventual IPO or M&A. Through a combination of business and corporate development, offered by HKSTP and industry experts in various fields, LEAP gives these exceptional individuals and businesses a chance to truly shine.
One of our member companies, which is a fast-growing smart wearable startup company in Hong Kong Science Park and Shenzhen Software Park, currently has the following opening:
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