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Firmware Engineer

Job Information

  • Post Date:2018-04-13
  • Career Level:Entry Level
  • Location:Not Specified
  • Salary:Salary negotiable
  • Employment Type:Full Time, Permanent
  • Job Function:Electrical / Electronics  Telecommunication / Wireless / Radio  Software Development  

Job Description

Responsibilities:

  • Embedded software development for Bluetooth, BLE, IOT etc.
  • Firmware development for system verification and test automation.
  • Work with hardware team to design and develop prototype board for product testing.
  • Assist in writing documentation like product user guide and product specifications.
  • Design and develop MCU based product applications.
  • Design and develop application software for early stages of product development.
  • Product development from concept to mass production.

Requirements:

  • Degree holder in Electronic Engineering, Computer Engineering or similar discipline.
  • Proficient in C programming and debugging.
  • Strong background in embedded wireless systems (C and C++ languages, MIPS and ARM CPU architecture).
  • Experience with wireless induction charging is a plus (Proprietary methods, Qi, A4WP).
  • Excellent troubleshooting and problem solving skills with smart common sense.
  • Experience with industry standards for wireless communications (such as Bluetooth, WLAN, or Zigbee, is also desirable).
  • Self-motivated, well-organized, independent and excellent interpersonal and communication skills.
  • Minimum 2 years of embedded Software development.
  • Less experienced or fresh graduates may be considered as "Assistant Firmware Engineer".

Additional info:

To apply, please email us with a resume that includes your expected salary and availability.

All personal data collected will be used solely for recruitment purpose.

Company Info

The Leading Enterprises Acceleration Programme ([email protected]) is a new initiative to further support the development of companies in Hong Kong Science& Technology Parks Corporation. LEAP is an ultra-tailored programme with one goal in mind -to turn elite startups into regional or global tech giants. LEAP nurtures select members of our Incubation Programmes and companies at Science Park and prepares them for eventual IPO or M&A. Through a combination of business and corporate development, offered by HKSTP and industry experts in various fields, LEAP gives these exceptional individuals and businesses a chance to truly shine.

One of our member companies, which is a fast-growing smart wearable startup company in Hong Kong Science Park and Shenzhen Software Park, currently has the following opening:

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