Senior IC Packaging Engineer 高級芯片封裝工程師
Rayben Technologies (HK) Limited
- Company Industries:Others
Job Information
- Post Date:2018-05-18
- Career Level:Senior
- Location:Not Specified
- Salary:Salary negotiable
- Employment Type:Full Time, Permanent
- Job Function:Engineering Project Management
Job Description
Responsibilities:
- Collaborate with various parties to develop packaging testing protocol, perform failure mode analysis on packaging issues and formulate innovative solutions
- In charge of various packaging projects to achieve process control and quality improvement
- Develop testing plans to evaluate the feasibility of packaging from concept, laboratory testing, to plant trials and implementation
- Support technical development including new material selection, material usage optimization and alteration of structural design
- Work with related department for the documentation on packaging materials specification, control plan, FMEA, etc.
- Participate in ad-hoc projects and assignment
- Occasionally travel to China
Requirements:
- Degree holder in Engineering or Materials Science or other related disciplines
- At least 5 years of relevant experience in the manufacturing field
- With strong analytical and project management skills
- Proficiency in MS Office; well versed in CAD
- Experience in the various power electronics product development and/or system integration, such as IPM, IGBT module, inverter, or converter, etc., is a plus
- Knowledge in 2D thermal simulation is plus
- Good command of written and spoken English and Chinese; Strong team spirit and interpersonal skills; Independent, responsible, aggressive and outgoing character.
- Immediately available is preferred
- Candidate with less experience will be considered as PACKAGING ENGINEER
Company Info
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