Alpha Power Solutions Limited (APS) is new local start up semiconductor company in Hong Kong focus on SiC technology. The core group started the SiC Diode project in 2015 which was funded by Innovation and Technology Commission, HKSAR. In 2018, the company introduced strategic investor from China Electronics Corporation Group to develop and commercialize Silicon & Silicon Carbide based power electronic devices & power modules for electrical power management and saving solutions.

Summary

This individual shall work in the Semiconductor Development team and be responsible for the development of SiC wafer fabrication process, including ion implantation, Oxidation and Post Oxidation Anneal, SiC dry/wet etch, wafer thinning and Laser anneal in the area of high power SiC based devices. The individual is required to be a self-starter, work independently and be motivated to achieve high quality & accurate results.

Principal Duties & Responsibilities

The statements below are intended to describe the general nature and level of work in this position. They are not intended to be an exhaustive list of all responsibilities. The position may require that employees perform other duties as assigned.

 As part of the semiconductor development team, the candidate is required to

• Develop and improve critical processes for use in existing and/or future products;
• Simulation of Ion Implantation using SRIM or similar software;
• Thermal oxidation and Post Oxidation Anneal optimization for SiC gate dielectric;
• SiC and dielectric etching process
• Run design of experiments (DOEs), sensitivity analysis, Cp/Cpk studies;
• Investigate yield and process control. Targeting physical cause of failure for yield loss and improving quality;
• Recommend and implement equipment and process modifications to improve production efficiencies, manufacturing techniques and production yields for existing products;
• Interact with product design and development personnel to ensure that processes and designs are compatible;
• Resolve a wide range of issues in creative ways;
• Work on problems of diverse scope where analysis of data requires evaluation of identifiable factors;
• Demonstrate good judgment in selecting methods and techniques for obtaining solutions;
• Create process documentation and procedures;
• Analyze and Organize data, draw correlations from complex process interactions and present results in a concise fashion;
• Work closely with the development and production engineers on development projects;
• Work closely with the development and production engineering teams on process definition and process transfer;
• Assess safety requirements and ensure these are integrated into the process;
• Work on continuous improvement projects for existing products/processes.

This position requires processing and testing experiments conducted in the clean room as well as performing follow up operations

Position Requirements

• Prefer experience in wafer fab setting and gathering/organizing data on processes and devices.
• Prefer experience with semiconductor processes and devices preferred.
• Prefer experience with thermal oxidation and post oxidation anneal for SiC gate dielectric are preferred.
• Experience with process development and control. Preferred involvement with device fabrication processes including photoresist coating, metal and dielectric deposition, chip scribing and its visual inspection
• Strong background in semiconductor device physics
• Demonstrated ability to work “hands on” with fabrication tasks where necessary

Skills required

• Strong Microsoft Office skills.
• Strong in JMP (statistical discovery tools for scientists and engineers) skills.
• Strong in MatLab skills
• Excellent verbal and written communication in both Chinese and English skills.
• Highly motivated and ability to work well with people.
• Work also require characterization skills such as using confocal microscope, surface profiler, ellipsometry, and SEM

Work Environment

• Work is performed indoors. Either in office or Cleanroom.
• Occasional travel to mainland China is required.

Education

M.S or Ph.D in Physics, Chemistry, Mechanical or Electrical Engineering are preferred. Candidate with Bsc. degree will also be considered for Junior Engineer post.