Ref: I4U173/JDB/060319

Job Duties:

• Conduct ITF R&D project related to novel 3D printing technology
• Develop circuit board for driving 6-axis servo driver and ink-jet print head
• Provide engineering solutions for product integration in the 3D printing technology in electronic and algorithms development based on established engineering principles and in accordance with provided specifications and requirements
• Assist in the preparation of technical proposals and documents, software user manual, liaise with vendors and external/internal parties, and follow-up project works
• Coordinate and participate in client meetings and deliver presentations
• Travel to Mainland China may be required for project implementation
• Support ad hoc projects and assignments when required

Job Requirements:

• Bachelor or Master Degree from disciplines such as Electronic/Computer Engineering/Computer Science from a local university
• Proficiency in C / C++ / C#
• Knowledge in embedded MCU programming, window programming and GUI application design
• Experience in Python, motor motion control and design (e.g PLC) and 3D printing technology an advantage
• Experience or understanding of firmware and embedded electronics, writing systems issue developments, design tools, test plans, design of experiments, printing algorithms and software packages
• Able to create post processors and have knowledge of “G-codes” and “M-codes” with strong mathematical skills (Arithmetic, geometry and trigonometry)
• Good interpersonal, presentation and communication skills, mature, self-motivated, confident and able to work under pressure
• Good command of both spoken and written English and Chinese, including Putonghua
• Applicants may be considered for other positions if not matching the requirements of the subject position

Notes:
This is a position funded by the Innovation and Technology Fund (ITF) Internship Programme for the R&D project from September 2018 to August 2020.

Applications:

HKPC will take into consideration both the quantitative and qualitative requirements of the post when selecting the suitable candidates. A competitive salary package commensurate with academic qualifications and experience will be offered. The successful candidates will be employed on a fixed-term contract basis, which is renewable subject to appointee’s performance and the Council’s development needs.

Applicants should send application, together with a detailed resume, current and expected salary and contact telephone number by email via "Apply Now" (quoting the reference number on the subject heading) on or before 20 March 2019.

Applications not quoting reference number will lead to late processing.

Personal data collected will be used for recruitment purpose only. Candidates not invited for interviews within 6 weeks may consider their applications unsuccessful and the applications will be disposed by HKPC within 12 months.