Job Responsibilities: 

• Responsible for RF and electronic sub-system design for high-speed fiber-optic transceiver and optical sensor products;
• High-speed PCB board layout and optimization;
• Design validation and failure analysis
• Perform 3D electromagnetic simulation for new RF package designs;
• Research latest high-speed packaging techniques for use in optoelectronic applications.
  
  

Requirement:

• Bachelor or above in Electronics engineering, Applied Physics or equivalent.
• 4 years of relevant experience in mixed-signal /RF circuit design and implementation, with actual product development 
• Experience with mixed-signal / RF PCB design and ability to layout the circuit to meet expected performance and designed specification.
• Familiar with EDA tools such as Altium Designer and Cadence Allegro
• Familiar with simulation tools such as HFSS and ADS
• Familiar with standard RF test & measurement tools such as oscilloscopes, network analysers & spectrum analysers.
• Understanding on the fundamental of optoelectronics is an advantage;
• Good communication skills with the ability to work in an international team
•  Ability to work independently and tackle tasks with minimal supervision.
•  Fresh graduates with solid circuit design knowledge will also be considered.
• Candidate with more relevant working experiences and solid circuit design experiences may also be considered for the ranking of senior engineer.

Remunerations & Benefits:

• Work locations in Hong Kong and travel to the PRC may be required
• Work Hours from 9am to 6pm
• 5-day work
• Hong Kong Public Holidays
• Chinese New Year Bonus

Application:

• To apply, please email us your resume, your availability to report duty and quote the Job Ref.
• Only short-listed candidates will be notified. Personal data provided by applicants will be used for consideration of an application only.

Application Deadline:

• Until this position is filled.
• Resumes received will strictly be used for recruitment-related purpose