Postdoctoral Fellow / Research Associate - Electronic Assemblies 
[Appointment period: thirty-six months]

Duties 

The appointees will report to the Project Leader and the Centre Director or his designate (currently Program Manager), and perform research and related work in the development of electrical and electronic modules with sensing and AI algorithms used for health monitoring of electronic systems.

(Ref No. R27-R28/P1.1)
P1.1: Informative feature discovery and selection

(Ref No. R27-R28/P1.2)
P1.2: Early detection of degradation in electronic interconnects 

(Ref No. R27-R28/P1.3)
P1.3:  Anomaly detection for systems under indeterminate operating conditions

For the post of Postdoctoral Fellow, the appointee will be required to:

(a) prepare literature review on the manufacturing process and testing requirement of electronic assemblies;

(b) design experiments as required in the health monitoring of modern electronic systems;

(c) develop feature recognition algorithms and create simulation models for different defects in the interconnections of the electronic assemblies; and

(d) prepare and publish relevant research papers in high-tier peer-reviewed journals and

(e) perform any other duties as assigned by the Centre Director or his delegates.

For the post of Research Associate, the appointee will be required to:

(a) conduct literature search on the manufacturing process and testing requirement of electronic assemblies;

(b) make prototypes and set up experiments as required in health monitoring of electronic systems;

(c) study feature recognition algorithms and simulation models for different defects in interconnects of the electronic assemblies; and

(d) prepare relevant technical reports and

(e) perform any other duties as assigned by the Centre Director or his delegates.

 
Qualifications 

Applicants for the post of Postdoctoral Fellow should have a doctoral degree in Product Engineering, Industrial Engineering, Electrical/Electronic Engineering or related disciplines.

Applicants for the post of Research Associate should have a master's degree in Product Engineering, Industrial Engineering, Electrical/Electronic Engineering, related disciplines.

For both posts, applicants should also have:

(a) good understanding in the manufacturing and assembly of prototypes for printed circuit boards (PCBs)/electrical and electronic components or devices; and

(b) experience in design of experiments, or failure analysis of electrical and electronic components will be an advantage; and

(c) basic knowledge of machine learning, and

(d) good interpersonal and communication skills; and a good command of written and spoken English.

*** Fresh graduates are welcome.

Remuneration

A highly competitive remuneration package will be offered. Applicants should state their current an expected salary in the application.

Application

1) Please download our job application form from "https://www.cairs.hk/assets/files/Careers/Job_Application_Form.pdf" 

2) Please return the completed application form, together with a detailed curriculum vitae, to the CAiRS by email to us or clicking "apply now"

Deadline for application
Recruitment will continue until the positions are filled.

Centre for Advances in Reliability and Safety Limited (CAiRS), initiated by The Hong Kong Polytechnic University, is a research centre admitted under [email protected] cluster and is established in 2020 with its operation located in the Hong Kong Science Park, New Territories, Hong Kong. The mission of CAiRS is to bridge academic and industrial counterparts to introduce and implement artificial intelligence methods and prognostic techniques to advance reliability and safety. The goal of the Centre is to improve reliability and safety of critical components and devices, products, systems and sub-systems designed, commissioned and/or manufactured by Hong Kong companies and enterprises. More information about the company can be found at http://www.cairs.hk.