Responsibilities:

• Develop advanced packaging techniques and processes for the assembly of high density and high performance electronic devices
• Closely working with external customers for technical support and process development
• Closely working with internal R&D and product teams to develop new processes and products

Requirements:

• MPhil. or PhD. in Material Science, Physics, Engineering or related disciplines
• Hand-on experience in various semiconductor assembly equipment is preferred
• Well-trained by DOE tool to construct and conduct Design of experiment (DOE) for various assembly process optimization
• Familiar with the analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope,
• Experience in semiconductor Front-end/ Back-end process development is preferred
• Experience of using ANSYS or ABACUS to build model for stress and thermal simulation is a plus
• Optimistic and positive attitude
• Good communication skill
• Work independently and also a good team player

Attractive salary and fringe benefits package will be offered to the right candidates.

Please visit our company website for our company background, products and other useful information.
Website: www.asmpt.com

Data collected will be used for recruitment purpose only. Suitable candidates may be referred to other vacancies within our company.